For more information contact:
Jackie Nemeth, School of Electrical and Computer Engineering
Contact Jackie Nemeth email@example.com
Rao Tummala to Receive IEEE CPMT Award
Atlanta (July 23, 2010) — Rao Tummala will receive the 2011 IEEE Components, Packaging, and Manufacturing Technology (CPMT) Award “for pioneering and innovative contributions to package integration research, cross-disciplinary education, and globalization of electronic packaging.”
This award recognizes lifelong contributions to industry, academia, and professional societies in components, packaging, and manufacturing technologies. Dr. Tummala will receive this honor at the IEEE 61st Electronic Components and Technology Conference, to be held next spring in Lake Buena Vista, Fla.
Dr. Tummala has been on the faculty of the School of Electrical and Computer Engineering at Georgia Tech since 1993. He is the director of the Packaging Research Center and holds the Joseph M. Pettit Chair in Packaging. He is also a Georgia Research Alliance Eminent Scholar.
School of Electrical and Computer Engineering
IEEE Components, Packaging, and Manufacturing Technology Society
The Georgia Institute of Technology is one of the nation's premier research universities. Ranked seventh among U.S. News & World Report's top public universities, Georgia Tech's more than 20,000 students are enrolled in its Colleges of Architecture, Computing, Engineering, Liberal Arts, Management and Sciences. Tech is among the nation's top producers of women and minority engineers. The Institute offers research opportunities to both undergraduate and graduate students and is home to more than 100 interdisciplinary units plus the Georgia Tech Research Institute.